Flexible Electronics News

Meyer Burger Concludes Divestment of Wafer Business to Precision Surfacing Solutions

Completes divestment of its photovoltaic and specialized materials wafering equipment and service business.

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By: DAVID SAVASTANO

Editor, Ink World Magazine

Meyer Burger Technology Ltd announced that it has concluded the divestment of its photovoltaic and specialized materials (e.g. semiconductor and sapphire glass industries) wafering equipment and service business to Precision Surfacing Solutions (PSS).   The sale was agreed and announced on February 7, 2019. The purchase price is CHF 50 million in cash and the contract includes an earn-out component based on certain revenue levels in 2019....

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